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LM3668 Datasheet(PDF) 5 Page - Texas Instruments

Part # LM3668
Description  1-A, High-Efficiency Dual-Mode Single-Inductor Buck-Boost DC-DC Converter
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LM3668 Datasheet(HTML) 5 Page - Texas Instruments

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LM3668
www.ti.com
SNVS449O – JUNE 2007 – REVISED APRIL 2015
7.4 Thermal Information
LM3668
THERMAL METRIC(1)
DQB (WSON)
UNIT
12 PINS
RθJA
Junction-to-ambient thermal resistance, WSON package(2)
47.3
RθJC(top)
Junction-to-case (top) thermal resistance
43..4
RθJB
Junction-to-board thermal resistance
21.6
°C/W
ψJT
Junction-to-top characterization parameter
0.4
ψJB
Junction-to-board characterization parameter
21.7
RθJC(bot)
Junction-to-case (bottom) thermal resistance
3.5
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
Junction-to-ambient thermal resistance (RθJA) is taken from a thermal modeling result, performed under the conditions and guidelines
set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 101.6 mm x 76.2 mm x 1.6 mm.
Thickness of the copper layers are 2oz/1oz/1oz/2oz. The middle layer of the board is 60 mm x 60 mm. Ambient temperature in
simulation is 22°C, still air. Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications
where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design.
7.5 Electrical Characteristics
Unless otherwise noted, specifications apply to the LM3668. VIN = 3.6 V = EN, VOUT = 3.3 V. For VOUT = 4.5V-5 V, VIN =
4 V.
(1) (2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VFB
Feedback voltage
−40°C ≤ TA ≤ 85°C, see
(2)
–3%
3%
Switch peak current limit
Open loop(3)
1.85
ILIM
A
Switch peak current limit
Open loop(3),
−40°C ≤ TA ≤ 85°C
1.6
2.05
Shutdown supply current
EN = 0 V
0.01
ISHDN
µA
Shutdown supply current
EN = 0 V,
−40°C ≤ TA ≤ 85°C
1
No load, device is not switching (FB
DC bias current in PFM
forced higher than programmed output
45
voltage)
IQ_PFM
µA
No load, device is not switching (FB
forced higher than programmed output
DC bias current in PFM
60
voltage)
−40°C ≤ TA ≤ 85°C
DC bias current in PWM
PWM mode, no switching
600
IQ_PWM
µA
PWM mode, no switching
DC bias current in PWM
750
−40°C ≤ TA ≤ 85°C
RDSON(P)
Pin-pin resistance for PFET
Switches P1 and P2
130
180
m
RDSON(N)
Pin-pin resistance for NFET
Switches N1 and N2
100
150
m
PWM mode
2.2
FOSC
Internal oscillator frequency
MHz
PWM mode,
−40°C ≤ TA ≤ 85°C
1.9
2.5
FSYNC
Sync frequency range
VIN = 3.6 V
1.6
2.7
MHz
Logic high input for EN,
VIH
−40°C ≤ TA ≤ 85°C
1.1
V
MODE/SYNC pins
Logic low input for EN,
VIL
−40°C ≤ TA ≤ 85°C
0.4
V
MODE/SYNC pins
0.3
IEN, MODE,
EN, MODE/SYNC pins input current
µA
SYNC
−40°C ≤ TA ≤ 85°C
1
(1)
All voltages with respect to SGND.
(2)
Minimum and Maximum limits are specified by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the
most likely norm.
(3)
Electrical Characteristics table reflects open loop data (FB = 0 V and current drawn from SW pin ramped up until cycle-by-cycle current
limits is activated). Closed loop current limit is the peak inductor current measured in the application circuit by increasing output current
until output voltage drops by 10%.
Copyright © 2007–2015, Texas Instruments Incorporated
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