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LM3253 Datasheet(PDF) 5 Page - Texas Instruments

Part # LM3253
Description  LM3253 High-Current Step-Down Converter for 2G/3G/4G RF Power Amplifiers
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LM3253 Datasheet(HTML) 5 Page - Texas Instruments

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LM3253
www.ti.com
SNVS791Q – FEBRUARY 2012 – REVISED MAY 2013
OPERATING RATINGS
(1)
Input Voltage Range
2.7V to 5.5V
Recommended Load Current
0A to 3.0A
Junction Temperature (TJ) Range
−30°C to +125°C
Ambient Temperature (TA) Range
(2)
−30°C to +90°C
(1)
All voltages are with respect to the potential at the GND pins. The LM3253 is designed for mobile phone applications where turn-on after
power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal
Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin LOW until the input voltage
exceeds 2.7V.
(2)
In applications where high-power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). At higher power levels duty
cycle usage is assumed to drop (i.e., max power 12.5% usage is assumed) for 2G mode.
THERMAL PROPERTIES
Junction-to-Ambient Thermal
50°C/W
Resistance (
θJA), YFQ Package
(1)
(1)
Junction-to-ambient thermal resistance (
θJA) is taken from thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7.
Copyright © 2012–2013, Texas Instruments Incorporated
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