TPS737

SBVS067Q – JANUARY 2006 – REVISED MAY 2015

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Table of Contents

8.1

Application Information............................................ 16

1

Features .................................................................. 1

8.2

Typical Applications ................................................ 16

2

Applications ........................................................... 1

8.3

Do's and Don'ts ....................................................... 18

3

Description ............................................................. 1

9

Power Supply Recommendations ...................... 18

4

Revision History..................................................... 2

10

Layout................................................................... 19

5

Pin Configuration and Functions ......................... 4

10.1

Layout Guidelines ................................................. 19

6

Specifications......................................................... 5

10.2

Layout Example .................................................... 19

6.1

Absolute Maximum Ratings ...................................... 5

10.3

Power Dissipation ................................................. 19

6.2

ESD Ratings ............................................................ 5

10.4

Thermal Protection................................................ 20

6.3

Recommended Operating Conditions ....................... 5

10.5

Estimating Junction Temperature ........................ 20

6.4

Thermal Information .................................................. 6

11

Device and Documentation Support ................. 22

6.5

Electrical Characteristics........................................... 7

11.1

Device Support...................................................... 22

6.6

Typical Characteristics .............................................. 8

11.2

Documentation Support ....................................... 22

7

Detailed Description ............................................ 13

11.3

Community Resources.......................................... 22

7.1

Overview ................................................................. 13

11.4

Trademarks ........................................................... 22

7.2

Functional Block Diagrams ..................................... 13

11.5

Electrostatic Discharge Caution ............................ 22

7.3

Feature Description................................................. 14

11.6

Glossary ................................................................ 23

7.4

Device Functional Modes........................................ 15

12

Mechanical, Packaging, and Orderable

8

Application and Implementation ........................ 16

Information ........................................................... 23

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision P (July 2013) to Revision Q

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

•

Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement ................... 5

•

Changed "free-air temperature" to "junction temperature" in Recommended Operating Conditions condition

statement ............................................................................................................................................................................... 5

•

Changes from Revision O (June 2012) to Revision P

Page

•

Added last paragraph to Description section.......................................................................................................................... 1

Changes from Revision N (June 2011) to Revision O

Page

•

Changed Thermal Information table data and footnote 2b..................................................................................................... 6

•

•

Changed title of Figure 6 ........................................................................................................................................................ 8

Changes from Revision M (October, 2010) to Revision N

Page

•

Added footnote (3) to Thermal Information table.................................................................................................................... 7

•

Added footnote to Figure 39 ................................................................................................................................................. 21

2

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