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TPA6130A2 Datasheet(PDF) 5 Page - Texas Instruments |
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TPA6130A2 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 39 page TPA6130A2 www.ti.com SLOS488F – NOVEMBER 2006 – REVISED MARCH 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VDD –0.3 6.0 V RIGHTINx, LEFTINx –2.5 3.6 V VI Input voltage SD, SCL, SDA –0.3 7 V Output continuous total power dissipation See the Thermal Information table TA Operating free-air temperature range –40 85 °C TJ Operating junction temperature range –40 150 °C Minimum Load Impedance 12.8 12.8 Ω (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, –8 8 kV output pins(1) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all V(ESD) Electrostatic discharge –3.5 3.5 kV other pins(1) Charged device model (CDM), per JEDEC specification –1500 1500 V JESD22-C101, all pins (2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VDD Supply voltage 2.5 5.5 V VIH High-level input voltage SCL, SDA, SD 1.3 V SCL, SDA 0.6 V VIL Low-level input voltage SD 0.35 V 7.4 Thermal Information RTJ YZH THERMAL METRIC(1) UNIT 20 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 34.8 75 RθJCtop Junction-to-case (top) thermal resistance 32.5 22 RθJB Junction-to-board thermal resistance 11.6 26 °C/W ψJT Junction-to-top characterization parameter 0.4 0.2 ψJB Junction-to-board characterization parameter 11.6 24 RθJCbot Junction-to-case (bottom) thermal resistance 3.1 N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPA6130A2 |
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