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TLV2217 Datasheet(PDF) 2 Page - Texas Instruments

Part No. TLV2217
Description  LOW-DROPOUT FIXED-VOLTAGE REGULATORS
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV2217 Datasheet(HTML) 2 Page - Texas Instruments

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TLV2217
LOW DROPOUT FIXEDVOLTAGE REGULATORS
SLVS067L − MARCH 1992 − REVISED APRIL 2005
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description/ordering information (continued)
The TLV2217 family of low-dropout regulators offers a variety of fixed-voltage options that offer a maximum
continuous input voltage of 16 V, making them more versatile than CMOS regulators. Utilizing a pnp pass
element, these regulators are capable of sourcing 500 mA of current, with a specified maximum dropout of
500 mV (3.3-V and 2.5-V options), making these regulators ideal for low-voltage applications. Additionally, the
TLV2217 regulators offer very tight output accuracy of
±2% across operating load and temperature ranges.
Other convenient features the regulators provide are internal overcurrent limiting, thermal-overload protection,
and overvoltage protection. The TLV2217 family of regulators is available in fixed voltages of 1.8 V, 2.5 V, and
3.3 V.
absolute maximum ratings over operating virtual junction temperature range (unless otherwise
noted)
Continuous input voltage, VI
16 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ
150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
package thermal data (see Note 1)
PACKAGE
BOARD
θJP‡
θJC
θJA
PowerFLEX
/TO-252 (KTP)
High K, JESD 51-5
1.4
°C/W
19
°C/W
28
°C/W
TO-220 (KC/KCS)
High K, JESD 51-5
3
°C/W
17
°C/W
19
°C/W
TSSOP (PW)
High K, JESD 51-7
32
°C/W
83
°C/W
‡ For packages with exposed thermal pads, such as QFN, PowerPAD, and PowerFLEX, θJP is defined as the thermal resistance between the die
junction and the bottom of the exposed pad.
NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
recommended operating conditions
MIN
MAX
UNIT
VI
Input voltage
3.0
12
V
IO
Output current
0
500
mA
TJ
Operating virtual junction temperature range
0
125
°C
§ Minimum VI is equal to 3.0 V or VO(max) + 0.6 V, whichever is greater.


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