LP38501-ADJ, LP38503-ADJ

SNVS522I – AUGUST 2007 – REVISED AUGUST 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

IN pin voltage (survival)

−0.3

6

V

EN pin voltage (survival)

−0.3

6

V

OUT pin voltage (survival)

−0.3

6

V

Internally limited

Internally limited

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Implementation.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Input supply voltage

2.7

5.5

V

Enable input voltage

0

5.5

V

Output current (DC)

0

3

A

0.6

5

V

−40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Implementation.

6.4 Thermal Information

LP38501 and LP38503

KTT(DDPAK/TO-263)

NDQ (TO-263)

UNIT

5 PINS

5 PINS

Junction-to-ambient thermal resistance

41.8

33.3

°C/W

Junction-to-case (top) thermal resistance

45.0

22.1

°C/W

Junction-to-board thermal resistance

24.8

16.9

°C/W

Junction-to-top characterization parameter

13.1

5.8

°C/W

Junction-to-board characterization parameter

23.8

16.8

°C/W

Junction-to-case (bottom) thermal resistance

2.4

2.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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