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LP3965ESX-ADJ Datasheet(PDF) 16 Page - Texas Instruments |
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LP3965ESX-ADJ Datasheet(HTML) 16 Page - Texas Instruments |
16 / 34 page LP3962, LP3965 SNVS066H – MAY 2000 – REVISED APRIL 2013 www.ti.com Figure 25. Maximum power dissipation vs ambient temperature for SFM/TO-263 package Figure 26 shows a curve for the θJA of SOT-223 package for different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area for heat sinking. Figure 26. θJA vs Copper(1 Ounce) Area for SOT-223 package Figure 27 through Figure 35 show different layout scenarios for SOT-223 package. Figure 27. SCENARIO A, θJA = 148°C/W Figure 28. SCENARIO B, θJA = 125°C/W 16 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LP3962 LP3965 |
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