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TC1070 Datasheet(PDF) 3 Page - Microchip Technology

Part No. TC1070
Description  50mA, 100mA and 150mA Adjustable CMOS LDOs with Shutdown
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Maker  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
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TC1070 Datasheet(HTML) 3 Page - Microchip Technology

 
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© 2002 Microchip Technology Inc.
DS21353B-page 3
TC1070/TC1071/TC1187
TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATION
S (CONTINUED)
Electrical Characteristics: VIN =VOUT +1V, IL =0.1mA,CL =3.3µF, SHDN >VIH,TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
SHDN Input
VIH
SHDN Input High Threshold
45
——
%VIN
VIN =2.5V to6.5V
VIL
SHDN Input Low Threshold
15
%VIN
VIN =2.5V to6.5V
ADJ Input
IADJ
Adjust Input Leakage Current
50
pA
Note
1:
2:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
3:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
4:
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
5:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA,TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
6: The minimum VIN has to justify the conditions: VIN ≥ VR +VDROPOUT and VIN ≥ 2.7V for IL =0.1mA to IOUT
MAX.
TC VOUT =(VOUTMAX –VOUTMIN)x 10
6
VOUT x ∆T


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