LP2989LV

SNVS086K – MAY 2000 – REVISED JULY 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

If Military/Aerospace specified devices are required contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(1)

MIN

MAX

UNIT

Operating junction temperature

–40

125

°C

Internally limited

Input supply voltage, survival

–0.3

16

V

SENSE pin

–0.3

6

V

–0.3

16

V

Short-circuit protected

–0.3

16

V

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package,

refer to Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401). Exceeding the maximum allowable power

dissipation causes excessive die temperature, and the regulator goes into thermal shutdown.

(3)

If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2989LV output must be diode-clamped

to ground.

(4)

The output PNP structure contains a diode between the IN and OUT pins that is normally reverse-biased. Forcing the output above the

input turns on this diode and may induce a latch-up mode which can damage the part.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Operating junction temperature

–40

125

°C

Operating input supply voltage

2.1

16

V

6.4 Thermal Information

LP2989LV

NGN (WSON)

D (SOIC)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance, High-K

34.8

114.5

°C/W

Junction-to-case (top) thermal resistance

28.4

61.1

°C/W

Junction-to-board thermal resistance

12.0

55.6

°C/W

Junction-to-top characterization parameter

0.2

9.7

°C/W

Junction-to-board characterization parameter

12.2

54.9

°C/W

Junction-to-case (bottom) thermal resistance

1.3

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2000–2015, Texas Instruments Incorporated

Product Folder Links: LP2989LV