DATA SHEET • SKY66100-11: TRANSMIT/RECEIVE FEM

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201829E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 1, 2015

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Evaluation Board Description

The SKY66100-11 Evaluation Board is used to test the

performance of the SKY66100-11 FEM. Evaluation Board

schematic diagrams are provided in Figure 12 (EK-1 board, +24

dBm) and in Figure 13 (EK-2 board, +27 dBm). An assembly

drawing for the Evaluation Board is shown in Figure 14.

Package Dimensions

The typical part marking for the SKY66100-11 is shown in

Figure 15. The PCB layout footprint for the SKY66100-11 is

provided in Figure 16. Figure 17 shows the package dimensions

for the 16-pin MCM, and Figure 18 provides the tape and reel

dimensions.

Package and Handling Information

Since the device package is sensitive to moisture absorption, it is

baked and vacuum packed before shipping. Instructions on the

shipping container label regarding exposure to moisture after the

container seal is broken must be followed. Otherwise, problems

related to moisture absorption may occur when the part is

subjected to high temperature during solder assembly.

The SKY66100-11 is rated to Moisture Sensitivity Level 3 (MSL3)

at 260

C. It can be used for lead or lead-free soldering. For

additional information, refer to the Skyworks Application Note,

PCB Design and SMT Assembly/Rework Guidelines for MCM-L

Packages, document number 101752.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.