BTC50010-1TAA & BTC30010-1TAA

General Product Characteristics

Data Sheet

11

1.3, 2015-02-06

Connect FET & Companion

BTC50010-1TAA & BTC30010-1TAA current robustness:

Below diagram present the current robustness of BTC50010-1TAA & BTC30010-1TAA. Generally, module

thermal characteristic is more depending on the module construction (e.g. PCB size, metal layer thickness and

numbers, module connectors) than the thermal characteristic of BTC50010-1TAA & BTC30010-1TAA alone.

When current pulse is longer than 0.3s, influence of module thermal characteristic is dominant. When current pulse

is shorter than 0.3s, influence of thermal characteristic of BTC50010-1TAA & BTC30010-1TAA is getting

significant.

Combining BTC50010-1TAA & BTC30010-1TAA together with a fuse in application, the total I/t curve of the

BTC50010-1TAA & BTC30010-1TAA can withstand minimum 10 fuse blows of a 40A ATO FUSE.

Figure 6

BTC50010-1TAA & BTC30010-1TAA Current Robustness at

T

13.5V 1)

1) Use test PCB with 2 x 70 µm Cu layers and size of 54 x 48 x 1.5 mm. Where applicable, thermal via array is placed under

the device footprint on this PCB. BTC50010-1TAA & BTC30010-1TAA on PCB have RthJA(2P) = 19.6 K/W (referring to

with 1 W power dissipation from each device). PCB is vertical, keep constant environment temperature by indirect airflow

of 6l/s.

0,1

1

10

100

1000

10

100

1000

Current [A]

BTC50010-1TAA and BTC30010-1TAA in parallel current robustness

PCB is vertical, keep constant enviroment temperature by airflow

Devices absolute max. ratings

@TA=125°C

Devices absolute max. ratings

@TA=25°C