BTC50010-1TAA & BTC30010-1TAA

General Product Characteristics

Data Sheet

10

1.3, 2015-02-06

Connect FET & Companion

Continuous drain current

BTC50010-1TAA

I

D

––

163

A

T

V

Current is limited by

bondwire

P_4.1.10

Continuous drain current of

BTC30010-1TAA

I

D_C

––

163

A

T

V

Current is limited by

bondwire

P_4.1.11

Power Stage

Average power dissipation

P

TOT

––

160

W

or BTC30010-1TAA

For

T

P_4.1.14

Temperatures

Junction Temperature

T

J

-40

–

150

°C

–

P_4.1.15

Dynamic Temperature increase

while switching

∆

T

J

––

60

K

–

P_4.1.16

Storage Temperature

T

STG

-55

–

150

°C

–

P_4.1.17

ESD Susceptibility

ESD Susceptibility (all pins)

V

ESD

-2

–

2

kV

P_4.1.18

ESD Susceptibility BTC50010-

1TAA OUT pin vs.

V

S

V

ESD_out

-4

–

4

kV

HBM7)

P_4.1.19

ESD Susceptibility BTC30010-

1TAA Drain pin

V

ESD_D

-4

–

4

kV

HBM7)

P_4.1.20

ESD Susceptibility BTC30010-

1TAA Source pin

V

ESD_S

-4

–

4

kV

HBM7)

P_4.1.21

1) Not subject to production test, specified by design.

2)

V

3) Relevant to application case such as loss of load, loss of battery (also negative ISO pulse).

4)

I

of load current to

I

5) Use test PCB with 2 x 70 µm Cu layers and size of 54 x 48 x 1.5 mm. Where applicable, thermal via array is placed under

the device footprint on this PCB. BTC50010-1TAA & BTC30010-1TAA on PCB have

R

power dissipation for each device). PCB is vertical, keep constant environment temperature by indirect airflow of 6L/s.

6)

P

7) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS-001-2010.

Table 4

T

specified). All parameters are specified for BTC50010-1TAA drives BTC30010-1TAA in parallel or anti serial

(unless otherwise specified).

Parameter

Symbol

Values

Unit

Note /

Test Condition

Number

Min.

Typ.

Max.