PRELIMINARY DATA SHEET • SKY85402-11: HIGH POWER (+22 dBm) 802.11ac WLAN PA

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

202120I • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 2, 2018

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Package Dimensions

The PCB layout footprint for the SKY85402-11 is provided in

Figure 12. Typical part markings are shown in Figure 13. Package

dimensions are shown in Figure 14, and tape and reel dimensions

are provided in Figure 15.

Package and Handling Information

Since the device package is sensitive to moisture absorption, it is

baked and vacuum packed before shipping. Instructions on the

shipping container label regarding exposure to moisture after the

container seal is broken must be followed. Otherwise, problems

related to moisture absorption may occur when the part is

subjected to high temperature during solder assembly.

The SKY85402-11 is rated to Moisture Sensitivity Level 3 (MSL3)

at 260

C. It can be used for lead or lead-free soldering. For

additional information, refer to the Skyworks Application Note,

Solder Reflow Information, document number 200164.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.