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TLV320DAC3101 Datasheet(PDF) 5 Page - Texas Instruments |
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TLV320DAC3101 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 100 page  TLV320DAC3101 www.ti.com SLAS666A – JANUARY 2010 – REVISED MAY 2012 Table 2-1. TERMINAL FUNCTIONS (continued) TERMINAL I/O DESCRIPTION NAME NO. MICBIAS 12 – Microphone bias for external microphone NC 4,15 I No connecton RESET 31 I Device reset SCL 10 I/O I2C control bus clock input SDA 9 I/O I2C control bus data input SPLM 19 O Left-channel class-D speaker-driver inverting output SPLP 22 O Left-channel class-D speaker-driver noninverting output SPLVDD 21 – Left-channel class-D speaker-driver power supply SPLVSS 20 – Left-channel class-D speaker-driver power supply ground SPRM 23 O Right-channel class-D speaker-driver inverting output SPRP 26 O Right-channel class-D speaker-driver noninverting output SPRVDD 24 – Right-channel class-D speaker-driver power supply SPRVSS 25 – Right-channel class-D speaker-driver power-supply ground Volume control or headphone detection. Note that microphone detection is also available on VOL/MICDET 11 I devices that have an ADC. WCLK 6 I/O Audio serial word clock 3 ELECTRICAL SPECIFICATIONS 3.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT AVDD to AVSS –0.3 to 3.9 V DVDD to DVSS –0.3 to 2.5 V HPVDD to HPVSS –0.3 to 3.9 V SPLVDD to SPLVSS –0.3 to 6 V SPRVDD to SPRVSS –0.3 to 6 V IOVDD to IOVSS –0.3 to 3.9 V Digital input voltage IOVSS – 0.3 to IOVDD + 0.3 V Analog input voltage AVSS – 0.3 to AVDD + 0.3 V Operating temperature range –40 to 85 °C Storage temperature range –55 to 150 °C Junction temperature (TJ Max) 105 °C Power dissipation (TJ Max – TA)/RθJA W RθJA thermal impedance (with thermal pad soldered to board) 35 °C/W (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 3-1. System Thermal Characteristics(1) Power Rating at 25°C Derating Factor Power Rating at 70°C Power Rating at 85°C 2.3 W 28.57 mW/°C 1 W 0.6 W (1) This data was taken using 2-oz. (0.071-mm thick) trace and copper pad that is soldered to a JEDEC high-K, standard 4-layer 3-in. × 3- in. (7.62-cm × 7.62-cm) PCB. Copyright © 2010–2012, Texas Instruments Incorporated ELECTRICAL SPECIFICATIONS 5 Submit Documentation Feedback Product Folder Link(s): TLV320DAC3101 |
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Similar Description - TLV320DAC3101_15 |
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