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LMP7731 Datasheet(PDF) 2 Page - Texas Instruments |
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LMP7731 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page LMP7731 SNOSAT6E – JULY 2007 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) ESD Tolerance (3) Human Body Model Inputs pins only 2000V All other pins 2000V Machine Model 200V Charge Device Model 1000V VIN Differential ±2V Supply Voltage (VS = V + – V−) 6.0V Storage Temperature Range −65°C to 150°C Junction Temperature (4) +150°C max Soldering Information Infrared or Convection (20 sec) 235°C Wave Soldering Lead Temp. (10 sec) 260°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics Tables. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (4) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. Operating Ratings (1) Temperature Range −40°C to 125°C Supply Voltage (VS = V + – V–) 1.8V to 5.5V Package Thermal Resistance ( θJA) 5-Pin SOT-23 265°C/W 8-Pin SOIC 190°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics Tables. 2.5V Electrical Characteristics (1) Unless otherwise specified, all limits are ensured for TA = 25°C, V + = 2.5V, V− = 0V, V CM = V +/2, R L >10 kΩ to V +/2. Boldface limits apply at the temperature extremes. Parameter Test Conditions Min (2) Typ (3) Max (2) Units ±500 VCM = 2.0V ±9 ±600 Input Offset Voltage VOS μV (4) ±500 VCM = 0.5V ±9 ±600 VCM = 2.0V ±0.5 ±5.5 Input Offset Voltage Temperature TCVOS μV/°C Drift VCM = 0.5V ±0.2 ±5.5 ±30 VCM = 2.0V ±1 ±45 IB Input Bias Current nA ±50 VCM = 0.5V ±12 ±75 (1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute maximum Ratings indicate junction temperature limits beyond which the device maybe permanently degraded, either mechanically or electrically. (2) All limits are specified by testing, statistical analysis or design. (3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. (4) Ambient production test is performed at 25°C with a variance of ±3°C. 2 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMP7731 |
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