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MIC5237-3.3BT Datasheet(PDF) 3 Page - Micrel Semiconductor |
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MIC5237-3.3BT Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 8 page January 2000 3 MIC5237 MIC5237 Micrel Electrical Characteristics V IN = VOUT + 1.0V; COUT = 4.7µF, IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Symbol Parameter Conditions Min Typical Max Units V OUT Output Voltage Accuracy variation from nominal V OUT –3 3 % –5 5 % ∆V OUT/∆T Output Voltage Note 2 40 ppm/ °C Temperature Coefficient ∆V OUT/VOUT Line Regulation V IN = VOUT + 1V to 16V 0.05 %/V 0.015 0.1 %/V ∆V OUT/VOUT Load Regulation I OUT = 100µA to 500mA, Note 3 0.05 0.5 % 0.7 % V IN – VOUT Dropout Voltage, Note 4 I OUT = 100µA10 70 mV 90 mV I OUT = 50mA 115 190 mV 280 mV I OUT = 150mA 165 350 mV 450 mV I OUT = 500mA 300 600 mV 700 mV I GND Ground Pin Current, Note 5 I OUT = 100µA80 130 µA 170 µA I OUT = 50mA 350 650 µA 900 µA I OUT = 150mA 1.8 2.5 mA 3.0 mA I OUT = 500mA 8 15 mA 20 mA PSRR Ripple Rejection f = 120Hz 75 dB I LIMIT Current Limit V OUT = 0V 700 900 mA 1000 ∆V OUT/∆PD Thermal Regulation Note 6 0.05 %/W e no Output Noise V OUT = 5.0V, IOUT = 50mA, 500 nV/ Hz C OUT = 2.2µF Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, T J(max), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: P D(max) = (TJ(max) –TA) ÷ θJA. Exceeding the maximum allowable power dissipa- tion will result in excessive die temperature, and the regulator will go into thermal shutdown. See the “Thermal Considerations” section for details. Note 2: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 3: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 100 µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Note 5: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Note 6: Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 500mA load pulse at V IN = 16V for t = 10ms. |
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