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MIC5219-2.6BM5 Datasheet(PDF) 8 Page - Micrel Semiconductor |
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MIC5219-2.6BM5 Datasheet(HTML) 8 Page - Micrel Semiconductor |
8 / 12 page MIC5219 Micrel MIC5219 8 July 2000 Applications Information The MIC5219 is designed for 150mA to 200mA output current applications where a high current spike (500mA) is needed for short, startup conditions. Basic application of the device will be discussed initially followed by a more detailed discus- sion of higher current applications. Enable/Shutdown Forcing EN (enable/shutdown) high (> 2V) enables the regu- lator. EN is compatible with CMOS logic. If the enable/ shutdown feature is not required, connect EN to IN (supply input). See Figure 5. Input Capacitor A 1 µF capacitor should be placed from IN to GND if there is more than 10 inches of wire between the input and the ac filter capacitor or if a battery is used as the input. Output Capacitor An output capacitor is required between OUT and GND to prevent oscillation. The minimum size of the output capacitor is dependent upon whether a reference bypass capacitor is used. 1 µF minimum is recommended when C BYP is not used (see Figure 5). 2.2 µF minimum is recommended when C BYP is 470pF (see Figure 6). For applications <3V, the output capacitor should be increased to 22 µF minimum to reduce start-up overshoot. Larger values improve the regulator’s transient response. The output capacitor value may be in- creased without limit. The output capacitor should have an ESR (equivalent series resistance) of about 5 Ω or less and a resonant frequency above 1MHz. Ultra-low-ESR capacitors could cause oscilla- tion and/or underdamped transient response. Most tantalum or aluminum electrolytic capacitors are adequate; film types will work, but are more expensive. Many aluminum electrolyt- ics have electrolytes that freeze at about –30 °C, so solid tantalums are recommended for operation below –25 °C. At lower values of output current, less output capacitance is needed for stability. The capacitor can be reduced to 0.47 µF for current below 10mA or 0.33 µF for currents below 1mA. No-Load Stability The MIC5219 will remain stable and in regulation with no load (other than the internal voltage divider) unlike many other voltage regulators. This is especially important in CMOS RAM keep-alive applications. Reference Bypass Capacitor BYP is connected to the internal voltage reference. A 470pF capacitor (C BYP) connected from BYP to GND quiets this reference, providing a significant reduction in output noise (ultra-low-noise performance). C BYP reduces the regulator phase margin; when using C BYP, output capacitors of 2.2µF or greater are generally required to maintain stability. The start-up speed of the MIC5219 is inversely proportional to the size of the reference bypass capacitor. Applications requiring a slow ramp-up of output voltage should consider larger values of C BYP. Likewise, if rapid turn-on is necessary, consider omitting C BYP. Thermal Considerations The MIC5219 is designed to provide 200mA of continuous current in two very small profile packages. Maximum power dissipation can be calculated based on the output current and the voltage drop across the part. To determine the maximum power dissipation of the package, use the thermal resistance, junction-to-ambient, of the device and the following basic equation. P = T – T D(max) J(max) A JA () θ T J(MAX) is the maximum junction temperature of the die, 125 °C, and T A is the ambient operating temperature. θJA is layout dependent; table 1 shows examples of thermal resis- tance, junction-to-ambient, for the MIC5219. Package θθθθθ JA Recommended θθθθθ JA 1" Square θθθθθ JC Minimum Footprint 2 oz. Copper MM8™ (MM) 160 °C/W 70 °C/W 30 °C/W SOT-23-5 (M5) 220 °C/W 170 °C/W 130 °C/W Table 1. MIC5219 Thermal Resistance The actual power dissipation of the regulator circuit can be determined using one simple equation. P D = (VIN – VOUT) IOUT + VIN IGND Substituting P D(MAX) for PD and solving for the operating conditions that are critical to the application will give the maximum operating conditions for the regulator circuit. For example, if we are operating the MIC5219-3.3BM5 at room temperature, with a minimum footprint layout, we can deter- mine the maximum input voltage for a set output current. P = 125 C – 25 C C/W D(max) °° () ° 220 P D(max) = 455mW The thermal resistance, junction-to-ambient, for the mini- mum footprint is 220 °C/W, taken from table 1. The maximum power dissipation number cannot be exceeded for proper operation of the device. Using the output voltage of 3.3V, and an output current of 150mA, we can determine the maximum input voltage. Ground current, maximum of 3mA for 150mA of output current, can be taken from the Electrical Character- istics section of the data sheet. 455mW = (V IN – 3.3V) × 150mA + VIN × 3mA 455mW = (150mA) × V IN + 3mA × VIN – 495mW 950mW = 153mA × V IN V IN = 6.2VMAX Therefore, a 3.3V application at 150mA of output current can accept a maximum input voltage of 6.2V in a SOT-23-5 package. For a full discussion of heat sinking and thermal effects on voltage regulators, refer to the Regulator Thermals section of Micrel’s Designing with Low-Dropout Voltage Regu- lators handbook. |
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