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ISL24021IRT065Z-T13 Datasheet(PDF) 10 Page - Intersil Corporation |
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ISL24021IRT065Z-T13 Datasheet(HTML) 10 Page - Intersil Corporation |
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10 / 13 page  ISL24021 10 FN6637.1 October 18, 2011 . . Typical Application Circuit A typical application of the ISL24021 is as a TFT-LCD VCOM driver (see Figure 27). A VCOM driver maintains the backplane common voltage of a TFT-LCD panel. Maintaining the VCOM voltage at a steady level is critical to panel performance. The ability of the ISL24021 to source/sink large peak short circuit currents make it ideal as a VCOM driver. The ±1A short circuit current capability combined with a large bandwidth and fast settling time give the ISL24021 ideal VCOM driver characteristics, and make it a great choice for TFT-LCD applications. Power Dissipation With a 300mA maximum continuous output drive capability, it is possible to exceed the rated +150°C maximum junction temperature. It is important to calculate the maximum power dissipation of the ISL24021 for the application. Proper load conditions will ensure that the ISL24021 junction temperature stays within a safe operating region. The ISL24021 has a built-in thermal protection, which automatically shuts the output OFF (high impedance) when the die temperature reaches +165°C. This ensures safe operation and prevents internal damage to the device. When the die cools by +15°C the output will automatically turn ON. The maximum power dissipation allowed in a package is determined according to Equation 1: where: •TJMAX = Maximum junction temperature •TAMAX = Maximum ambient temperature • θJA = Thermal resistance of the package •PDMAX = Maximum power dissipation in the package The actual maximum power dissipation of the IC is the total quiescent supply current, times the total power supply voltage, plus the power dissipation in the IC caused by the loading condition. Sourcing: Sinking: •VS = Total supply voltage range (VDD - VSS) •IS = Device supply current •VDD = Positive supply voltage •VSS = Negative supply voltage •VOUT = Output voltage •ILOAD = Load current Device overheating can be avoided by calculating the minimum resistive load condition, RLOAD, resulting in the highest power dissipation. To find RLOAD, set the two PDMAX equations equal to each other and solve for VOUT/ILOAD. Reference the package power dissipation curve, Figure 28, for further information. ISL24021 INP OUT CSNUBBER RSNUBBER VDD 4.7µF 0.1µF 0.1µF 4.7µF VSS THERMAL PAD CONNECTED TO VSS INN ZL FIGURE 25. OUTPUT SNUBBER CIRCUIT ISL24021 INP OUT RSERIES VDD 4.7µF 0.1µF 0.1µF 4.7µF VSS THERMAL PAD CONNECTED TO VSS INN ZL FIGURE 26. OUTPUT SERIES RESISTOR CIRCUIT INP OUT VDD = 15V 4.7µF 0.1µF VSS NOTE: CSTORAGE WILL VARY DEPENDING ON THE APPLICATION INN PANEL ISL24021 TFT-LCD CAPACITANCE VCOM CALIBRATOR/ RESISTOR LADDER THERMAL PAD CONNECTED TO VSS - + CSTORAGE + 0.1µF FIGURE 27. TYPICAL APPLICATION CIRCUIT: TFT-LCD VCOM PDMAX TJMAX TAMAX – ΘJA ---------------------------------------- = (EQ. 1) PDMAX VS IS VDD VOUT) ILOAD × – [] + × = (EQ. 2) PDMAX VS IS VOUT VSS) ILOAD × – [] + × = (EQ. 3) |
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