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ISL6596IRZ Datasheet(PDF) 7 Page - Intersil Corporation |
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ISL6596IRZ Datasheet(HTML) 7 Page - Intersil Corporation |
7 / 11 page 7 FN9240.1 January 22, 2010 Operation and Adaptive Shoot-Through Protection Designed for high speed switching, the ISL6596 MOSFET driver controls both high-side and low-side N-Channel FETs from one externally provided PWM signal. A rising transition on PWM initiates the turn-off of the lower MOSFET (see “Timing Diagram” on page 6). After a short propagation delay [tPDLL], the lower gate begins to fall. Typical fall times [tFL] are provided in the “Electrical Specifications” table on page 4. Adaptive shoot-through circuitry monitors the LGATE voltage and turns on the upper gate following a short delay time [tPDHU] after the LGATE voltage drops below ~1V. The upper gate drive then begins to rise [tRU] and the upper MOSFET turns on. A falling transition on PWM indicates the turn-off of the upper MOSFET and the turn-on of the lower MOSFET. A short propagation delay [tPDLU] is encountered before the upper gate begins to fall [tFU]. The adaptive shoot-through circuitry monitors the UGATE-PHASE voltage and turns on the lower MOSFET a short delay time, tPDHL, after the upper MOSFET’s gate voltage drops below 1V. The lower gate then rises [tRL], turning on the lower MOSFET. These methods prevent both the lower and upper MOSFETs from conducting simultaneously (shoot-through), while adapting the dead time to the gate charge characteristics of the MOSFETs being used. This driver is optimized for voltage regulators with large step down ratio. The lower MOSFET is usually sized larger compared to the upper MOSFET because the lower MOSFET conducts for a longer time during a switching period. The lower gate driver is therefore sized much larger to meet this application requirement. The 0.4 Ω on-resistance and 4A sink current capability enable the lower gate driver to absorb the current injected into the lower gate through the drain-to-gate capacitor of the lower MOSFET and help prevent shoot through caused by the self turn-on of the lower MOSFET due to high dV/dt of the switching node. PWM Input and Threshold Control A unique feature of the ISL6596 is the programmable PWM logic threshold set by the control pin (VCTRL) voltage. The VCTRL pin should connect to the VCC of the controller, thus the PWM logic threshold follows with the voltage level of the controller. For 5V applications, this pin can tie to the driver VCC and simplify the routing. The ISL6596 also features the adaptable tri-state PWM input. Once the PWM signal enters the shutdown window, either MOSFET previously conducting is turned off. If the PWM signal remains within the shutdown window for longer than the gate turn-off propagation delay of the previously conducting MOSFET, the output drivers are disabled and both MOSFET gates are pulled and held low. The shutdown state is removed when the PWM signal moves outside the shutdown window. The PWM rising and falling thresholds outlined in the “Electrical Specifications” on page 4 determine when the lower and upper gates are enabled. During normal operation in a typical application, the PWM rise and fall times through the shutdown window should not exceed either output’s turn-off propagation delay plus the MOSFET gate discharge time to ~1V. Abnormally long PWM signal transition times through the shutdown window will simply introduce additional dead time between turn off and turn on of the synchronous bridge’s MOSFETs. For optimal performance, no more than 50pF parasitic capacitive load should be present on the PWM line of ISL6596 (assuming an Intersil PWM controller is used). Bootstrap Considerations This driver features an internal bootstrap diode. Simply adding an external capacitor across the BOOT and PHASE pins completes the bootstrap circuit. Equation 1 helps select a proper bootstrap capacitor size: where QG1 is the amount of gate charge per upper MOSFET at VGS1 gate-source voltage and NQ1 is the number of control MOSFETs. The ΔVBOOT_CAP term is defined as the allowable droop in the rail of the upper gate drive. As an example, suppose two IRLR7821 FETs are chosen as the upper MOSFETs. The gate charge, QG, from the data sheet is 10nC at 4.5V (VGS) gate-source voltage. Then the QGATE is calculated to be 22nC at VCC level. We will assume a 200mV droop in drive voltage over the PWM cycle. We find that a bootstrap capacitance of at least 0.110µF is required. The next larger standard value capacitance is 0.22µF. A good quality ceramic capacitor is recommended. C BOOT_CAP Q GATE ΔV BOOT_CAP -------------------------------------- ≥ Q GATE Q G1 VCC • V GS1 ------------------------------- N Q1 • = (EQ. 1) 20nC ΔV BOOT_CAP (V) 2.0 1.6 1.4 1.0 0.8 0.6 0.4 0.2 0.0 0.3 0.0 0.1 0.2 0.4 0.5 0.6 0.9 0.7 0.8 1.0 QGATE = 100nC 1.2 1.8 FIGURE 2. BOOTSTRAP CAPACITANCE vs BOOT RIPPLE VOLTAGE ISL6596 |
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