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TPS61222-EP Datasheet(PDF) 12 Page - Texas Instruments

Part # TPS61222-EP
Description  LOW INPUT VOLTAGE, 0.7-V BOOST CONVERTER WITH 5.5-關A QUIESCENT CURRENT
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
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TPS61222-EP Datasheet(HTML) 12 Page - Texas Instruments

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TPS61222-EP
SLVSBI2 – SEPTEMBER 2012
www.ti.com
The following inductor series from different suppliers have been used with TPS61222 converters:
Table 2. List of Inductors(1)
VENDOR
INDUCTOR SERIES
EPL3015
Coilcraft
EPL2010
Murata
LQH3NP
Tajo Yuden
NR3015
Wurth Elektronik
WE-TPC Typ S
(1)
Design was tested using these components at 25°C ambient
temperature.
Capacitor Selection
Input Capacitor
At least a 10-
μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior
of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and GND pins of the
IC is recommended.
Output Capacitor
For the output capacitor C2 , it is recommended to use small ceramic capacitors placed as close as possible to
the VOUT and GND pins of the IC. If, for any reason, the application requires the use of large capacitors which
can not be placed close to the IC, the use of a small ceramic capacitor with an capacitance value of around
2.2
μF in parallel to the large one is recommended. This small capacitor should be placed as close as possible to
the VOUT and GND pins of the IC.
A minimum capacitance value of 4.7
μF should be used, 10 μF are recommended. If the inductor value exceeds
4.7
μH, the value of the output capacitance value needs to be half the inductance value or higher for stability
reasons, see Equation 4.
(4)
The TPS61222 is not sensitive to the ESR in terms of stability. Using low ESR capacitors, such as ceramic
capacitors, is recommended anyway to minimize output voltage ripple. If heavy load changes are expected, the
output capacitor value should be increased to avoid output voltage drops during fast load transients.
Layout Considerations
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control ground
current. Assure that the ground traces are connected close to the device GND pin.
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
12
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Links :TPS61222-EP


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