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CSD87333Q3D Datasheet(PDF) 3 Page - Texas Instruments

Part # CSD87333Q3D
Description  CSD87333Q3D Synchronous Buck NexFET??Power Block
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

CSD87333Q3D Datasheet(HTML) 3 Page - Texas Instruments

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CSD87333Q3D
www.ti.com
SLPS350 – FEBRUARY 2014
5 Specifications
5.1 Absolute Maximum Ratings
(1)
TA = 25°C (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
MAX
UNIT
VIN to PGND
–0.8
30
V
VSW to PGND
30
V
Voltage Range
VSW to PGND (10ns)
32
V
TG to TGR
–0.3
10
V
BG to PGND
–0.3
10
V
Pulsed Current Rating, IDM
40
A
Power Dissipation, PD
6
W
Sync FET, ID = 19, L = 0.1mH
18
Avalanche Energy EAS
mJ
Control FET, ID = 19, L = 0.1mH
18
Operating Junction Temperature Range, TJ
–55
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
5.2 Handling Ratings
PARAMETER
DEFINITION
MIN
MAX
UNIT
Tstg
Storage Temperature Range
–55
150
°C
5.3 Recommended Operating Conditions
TA = 25° (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
MAX
UNIT
VGS
Gate Drive Voltage
3.3
8
V
VIN
Input Supply Voltage
24
V
fSW
Switching Frequency
CBST = 0.1 µF (min)
1500
kHz
Operating Current
15
A
TJ
Operating Temperature
125
°C
5.4 Power Block Performance
(1)
TA = 25° (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
VIN = 12 V, VGS = 5 V, VOUT = 3.3 V,
PLOSS
Power Loss(1)
IOUT = 8 A, fSW = 500 kHz,
1.5
W
LOUT = 1 µH, TJ = 25ºC
IQVIN
VIN Quiescent Current
TG to TGR = 0 V BG to PGND = 0 V
10
µA
(1)
Measurement made with six 10-µF (TDK C3216X5R1C106KT or equivalent) ceramic capacitors placed across VIN to PGND pins and
using a high current 5V driver IC.
Copyright © 2014, Texas Instruments Incorporated
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