CHM2378a

W-band Dual Channel Mixer

Ref. DSCHM2378a6354 - 20 Dec 06

6/8

Specifications subject to change without notice

Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09

Typical Assembly Configuration

L_lo

µ-strip line

L_rf2

µ-strip line

L_rf1

µ-strip line

R_bias

C1

+V

IF1

120pF

R_bias

C2

+V

IF2

120pF

This drawing shows an example of assembly configuration. The bias and IF inter-

connections are according to the example given in the previous chapter.

For the RF pads the equivalent wire bonding inductance (diameter=25µm) have

to be according to the following recommendation.

Port

Equivalent inductance

(nH)

Approximative wire

length (mm)

LO (2)

L_lo= 0.26

0.33

RF1 (10)

L_rf1 = 0.26

0.33

RF2 (13)

L_rf2 = 0.26

0.33

For a micro-strip configuration a hole in the substrate is recommended for chip

assembly.

As the connections at 77GHz (between MMIC and MMIC or between MMIC and

external substrate) are critical, the transition matching network is split into two

parts: one on MMIC and one on the external substrate. This choice allows doing

both kinds of connections.