PMEG3015EH_EJ_3

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 03 — 13 January 2010

6 of 9

NXP Semiconductors

PMEG3015EH; PMEG3015EJ

10. Soldering

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 6.

Reflow soldering footprint SOD123F

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 7.

Reflow soldering footprint SOD323F (SC-90)

1.6

1.6

2.9

4

4.4

1.1 1.2

2.1

1.1

(2

×)

solder lands

solder resist

occupied area

solder paste

001aab169

1.65

0.50

(2

×)

2.10

1.60

2.80

0.60

3.05

0.50

0.95

solder lands

solder resist

occupied area

solder paste