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CHC3014-99F Datasheet(PDF) 16 Page - United Monolithic Semiconductors

Part No. CHC3014-99F
Description  X-band Core Chip
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Maker  UMS [United Monolithic Semiconductors]
Homepage  http://www.ums-gaas.com
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CHC3014-99F Datasheet(HTML) 16 Page - United Monolithic Semiconductors

 
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CHC3014-99F
X-band Core Chip
Ref. : DSCHC3014-0293 - 20 Sep 10
16/20
Specifications subject to change without notice
Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Recommended assembly plan
Note: Biasing pads 2-5-25-27 can be commonly connected to the +5V supply voltage
Bonding length recommendations
Pad name
Description
Connection
IO
TX
RX
(Pad 1)
(Pad 6)
(Pad 24)
TXin/Rxout
Txout
RXin
Inductance (Lbonding) = 0.3nH
Two wires: diameter 25µm, length 0.470µm
All others
DC and Interface
pads
Inductance (Lbonding) = 0.8nH
One wire: diameter 25µm, length 1mm


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