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UB6054G-AF5-R Datasheet(PDF) 9 Page - Unisonic Technologies

Part # UB6054G-AF5-R
Description  ONE-CELL STANDALONE LINEAR LITHIUM BATTERY CHARGER
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Manufacturer  UTC [Unisonic Technologies]
Direct Link  http://www.utc-ic.com
Logo UTC - Unisonic Technologies

UB6054G-AF5-R Datasheet(HTML) 9 Page - Unisonic Technologies

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UB6054
Preliminary
CMOS IC
UNISONICTECHNOLOGIESCO.,LTD
9 of 13
www.unisonic.com.tw
QW-R52-867.a
APPLICATION INFORMATION(Cont.)
Thermal Considerations
Because of the small size of the ThinSOT package, it is very important to use a good thermal PC board layout to
maximize the available charge current. The thermal path for the heat generated by the IC is from the die to the
copper lead frame, through the package leads, (especially the ground lead) to the PC board copper. The PC board
copper is the heat sink. The footprint copper pads should be as wide as possible and expand out to larger copper
areas to spread and dissipate the heat to the surrounding ambient. Feed-through vias to inner or backside copper
layers are also useful in improving the overall thermal performance of the charger. Other heat sources on the board,
not related to the charger, must also be considered when designing a PC board layout because they will affect
overall temperature rise and the maximum charge current. The following table lists thermal resistance for several
different board sizes and copper areas. All measurements were taken in still air on 3/32" FR-4 board with the device
mounted on topside.
Table 1 Measured Thermal Resistance on 2-Layer Board (Note 1)
COPPER AREA
BOARD AREA
THERMAL RESISTANCE (θJA)
JUNCTION-TO-AMBIENT
TOPSIDE
BACKSIDE
2500mm
2
2500mm
2
2500mm
2
125°C/W
1000mm
2
2500mm
2
2500mm
2
125°C/W
225mm
2
2500mm
2
2500mm
2
130°C/W
100mm
2
2500mm
2
2500mm
2
135°C/W
50mm
2
2500mm
2
2500mm
2
150°C/W
Note:
1. Each layer uses one ounce copper
Table 2 Measured Thermal Resistance on 4-Layer Board (Note 1)
COPPER AREA (EACH SIDE)
BOARD AREA
THERMAL RESISTANCE (θJA)
JUNCTION-TO-AMBIENT
2500mm
2 (Note 2)
2500mm
2
80°C/W
Notes:
1.
Top and bottom layers use two ounce copper, inner layer use one ounce copper
2.
10,000mm
2 total copper area
Increasing Thermal Regulation Current
Reducing the voltage drop across the internal MOSFET can significantly decrease the power dissipation in the IC.
This has the effect of increasing the current delivered to the battery during thermal regulation. One method is by
dissipating some of the power through an external component, such as a resistor or diode. While this application
delivers more energy to the battery and reduces charge time in thermal mode, it may actually lengthen charge time
in voltage mode if VCC becomes low enough to put the UTC UB6054 into dropout. Figure 2 shows how this circuit
can result in dropout as RCC becomes large. This technique works best when RCC values are minimized to keep
component size small and avoid dropout. Remember to choose a resistor with adequate power handling capability.
Fig2. A Circuit to Maximize Thermal Mode Charge Current


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