DRV8846

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SLLSEK2 – JUNE 2014

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature referenced with respect to GND (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply voltage (VM)

–0.3

20

V

Power supply voltage ramp rate (VM)

0

2

V/µs

Internal regulator voltage (VINT)

–0.3

3.6

V

Analog input pin voltage (VREF)

–0.3

3.6

V

Control pin voltage (nENABLE, STEP, DIR, I0, I1, M0, M1, DEC0, DEC1, TOFF_SEL, nSLEEP,

–0.3

7.0

V

nFAULT, ADEC)

Continuous phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2)

–0.3

VM + 0.6

V

–0.6

0.6

V

Peak drive current (AOUT1, AOUT2, BOUT1, BOUT2, AISEN, BISEN)

Internally limited

A

Operating junction temperature

–40

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Transients of ±1 V for less than 25 ns are acceptable.

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

–4

4

Electrostatic

kV

discharge

–1.5

1.5

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VM

4

18

V

VREF

1

3.3

V

Applied STEP signal

0

250

kHz

VINT external load current

1

mA

0

1

A

Operating ambient temperature

–40

85

°C

(1)

(2)

Operational at VREF between 0 to 1 V, but accuracy is degraded

(3)

Power dissipation and thermal limits must be observed

7.4 Thermal Information

DRV8846

QFN

UNIT

24 PINS

Junction-to-ambient thermal resistance

34

Junction-to-case (top) thermal resistance

36.9

Junction-to-board thermal resistance

12.5

°C/W

Junction-to-top characterization parameter

0.4

Junction-to-board characterization parameter

12.5

Junction-to-case (bottom) thermal resistance

2.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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