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MAX6627 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part No. MAX6627
Description  Remote ±1°C Accurate Digital Temperature Sensors with SPI-Compatible Serial Interface
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Maker  MAXIM [Maxim Integrated Products]
Homepage  http://www.maxim-ic.com
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Remote ±1°C Accurate Digital Temperature
Sensors with SPI-Compatible Serial Interface
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
All Voltages Referenced to GND
VCC ...........................................................................-0.3V to +6V
SO, SCK, DXP, CS ........................................-0.3V to VCC + 0.3V
DXN .......................................................................-0.3V to +0.8V
SO Pin Current Range.........................................-1mA to +50mA
Current Into All Other Pins ..................................................10mA
ESD Protection (Human Body Model)................................2000V
Continuous Power Dissipation (TA = +70°C)
8-Pin SOT23 (derate 9.7mW/°C above +70°C)...........777mW
Operating Temperature Range .........................-55°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) ...................................Note 1
ELECTRICAL CHARACTERISTICS
(3.0V
≤ VCC ≤ 5.5V, -55°C ≤ TA ≤ +125°C, unless otherwise noted. Typical values are at TA = +25°C, VCC = +3.3V, unless otherwise
noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
TEMPERATURE
0
°C ≤ TRJ ≤ +125°C, TA = +30°C,
VCC = +3.3V
-1.0
±0.5
±1
-55
°C ≤ TRJ ≤ +100°C, 0°C ≤ TA ≤ +70°C,
VCC = +3.3V
-2.4
+2.4
-55
°C ≤ TRJ ≤ +145°C, 0°C ≤ TA ≤ +70°C,
VCC = +3.3V
-4.5
+4.5
Accuracy
-55
°C ≤ TRJ ≤ +125°C, -55°C ≤ TA ≤ +125°C,
VCC = +3.3V
-5.5
+5.5
°C
Power-Supply Sensitivity
0.25
0.7
°C/V
Resolution
0.0625
°C
MAX6627
0.5
Time Between Conversion Starts
tSAMPLE
MAX6628
8
s
Conversion Time
tCONV
180
250
320
ms
POWER SUPPLY
Supply Voltage Range
VCC
3.0
5.5
V
ISD
Shutdown, VCC = +0.8V
5
IIDLE
ADC idle,
CS = low
20
Supply Current, SCK Idle
ICONV
ADC converting
360
600
µA
MAX6627
200
400
Average Operating Current
ICC
MAX6628
30
50
µA
Power-On Reset (POR)
Threshold
VCC, falling edge
1.6
V
High level
80
100
120
Current Sourcing for Diode
Low level
8
10
12
µA
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles
recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection
Reflow. Preheating is required. Hand or wave soldering is not allowed.




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