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IRFY9130C Datasheet(PDF) 1 Page - International Rectifier |
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IRFY9130C Datasheet(HTML) 1 Page - International Rectifier |
1 / 7 page Absolute Maximum Ratings Parameter Units ID @ VGS = -10V, TC = 25°C Continuous Drain Current -11.2 ID @ VGS = -10V, TC = 100°C Continuous Drain Current -7.1 IDM Pulsed Drain Current À -44 PD @ TC = 25°C Max. Power Dissipation 75 W Linear Derating Factor 0.6 W/°C VGS Gate-to-Source Voltage ±20 V EAS Single Pulse Avalanche Energy Á 400 mJ IAR Avalanche Current À -11.2 A EAR Repetitive Avalanche Energy À 7.5 mJ dv/dt Peak Diode Recovery dv/dt  -5.5 V/ns TJ Operating Junction -55 to 150 TSTG Storage Temperature Range Lead Temperature 300(0.063in./1.6mm from case for 10 sec) Weight 4.3 (Typical) g HEXFET® MOSFET technology is the key to International Rectifier’s advanced line of power MOSFET transistors. The efficient geometry design achieves very low on-state resistance combined with high transconductance. HEXFET transistors also feature all of the well-established advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical parameter temperature stability. They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers, high energy pulse circuits, and virtually any application where high reliability is required. The HEXFET transistor’s totally isolated package eliminates the need for additional isolating material between the device and the heatsink. This improves thermal efficiency and reduces drain capacitance. °C A POWER MOSFET THRU-HOLE (TO-257AA) 02/09/10 www.irf.com 1 100V, P-CHANNEL HEXFET ® MOSFET TECHNOLOGY TO-257AA Product Summary Part Number RDS(on) ID Eyelets IRFY9130C 0.3 Ω -11.2A Ceramic IRFY9130CM 0.3 Ω -11.2A Ceramic Features: n Simple Drive Requirements n Ease of Paralleling n Hermetically Sealed n Electrically Isolated n Ceramic Eyelets n Ideally Suited For Space Level Applications For footnotes, refer to the last page IRFY9130C, IRFY9130CM PD-91293C |
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