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ICS859S0412I Datasheet(PDF) 8 Page - Integrated Device Technology

Part # ICS859S0412I
Description  Maximum output frequency
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

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ICS859S0412I Data Sheet
4:2, DIFFERENTIAL-TO-LVPECL/LVDS CLOCK MULTIPLEXER
ICS859S0412BGI REVISION A MAY 23, 2012
8
©2012 Integrated Device Technology, Inc.
Table 6C. LVDS AC Characteristics, VCC = 3.3V ± 5%, TA = -40°C to 85°C
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device
is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal
equilibrium has been reached under these conditions.
NOTE: All parameters are measured at fOUT  1.5GHz, unless otherwise noted.
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the differential output
crossing point.
NOTE 3: These parameters are guaranteed by characterization. Not tested in production.
NOTE 4: Defined as skew between outputs on different devices operating a the same supply voltage, same temperature, same frequency and
with equal load conditions. Using the same type of input on each device, the output is measured at the differential cross points.
Using the same type of input on each device, the output is measured at the differential cross points.
Table 6D. LVDS AC Characteristics, VCC = VCC_TAP = 2.5V ± 5%, TA = -40°C to 85°C
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device
is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal
equilibrium has been reached under these conditions.
NOTE: All parameters are measured at fOUT  1.5GHz, unless otherwise noted.
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the differential output
crossing point.
NOTE 3: These parameters are guaranteed by characterization. Not tested in production.
NOTE 4: Defined as skew between outputs on different devices operating a the same supply voltage, same temperature, same frequency and
with equal load conditions. Using the same type of input on each device, the output is measured at the differential cross points.
Using the same type of input on each device, the output is measured at the differential cross points.
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
fOUT
Output Frequency
3GHz
tPD
Propagation Delay; NOTE 1
400
800
ps
tjit
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter Section
100MHz, Integration Range:
12kHz – 20MHz
0.26
0.30
ps
tsk(o)
Output Skew; NOTE 2, 3
25
ps
tsk(pp)
Part-to-Part Skew; NOTE 3, 4
100
ps
tR / tF
Output Rise/Fall Time
20% to 80%
50
200
ps
odc
Output Duty Cycle
46
54
%
MUXISOLATION
MUX Isolation
ƒOUT < 1.2GHz
45
dB
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
fOUT
Output Frequency
3GHz
tPD
Propagation Delay; NOTE 1
400
800
ps
tjit
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter Section
100MHz, Integration Range:
12kHz – 20MHz
0.26
0.31
ps
tsk(o)
Output Skew; NOTE 2, 3
25
ps
tsk(pp)
Part-to-Part Skew; NOTE 3, 4
100
ps
tR / tF
Output Rise/Fall Time
20% to 80%
50
200
ps
odc
Output Duty Cycle
46
54
%
MUXISOLATION
MUX Isolation
ƒOUT < 1.2GHz
45
dB


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