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IRFMG40 Datasheet(PDF) 1 Page - International Rectifier |
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IRFMG40 Datasheet(HTML) 1 Page - International Rectifier |
1 / 7 page Absolute Maximum Ratings Parameter Units ID @ VGS = 10V, TC = 25°C Continuous Drain Current 3.9 ID @ VGS = 10V, TC = 100°C Continuous Drain Current 2.5 IDM Pulsed Drain Current ➀ 16 PD @ TC = 25°C Max. Power Dissipation 125 W Linear Derating Factor 1.0 W/°C VGS Gate-to-Source Voltage ±20 V EAS Single Pulse Avalanche Energy ➁ 530 mJ IAR Avalanche Current ➀ 3.9 A EAR Repetitive Avalanche Energy ➀ 12.5 mJ dv/dt Peak Diode Recovery dv/dt ➂ 1.0 V/ns T J Operating Junction -55 to 150 TSTG Storage Temperature Range Lead Temperature 300(0.063in./1.6mm from case for 10 sec) Weight 9.3 (Typical) g PD - 90710B HEXFET® MOSFET technology is the key to International Rectifier’s advanced line of power MOSFET transistors. The efficient geometry design achieves very low on-state re- sistance combined with high transconductance. HEXFET transistors also feature all of the well-established advan- tages of MOSFETs, such as voltage control, very fast switch- ing, ease of paralleling and electrical parameter temperature stability. They are well-suited for applications such as switch- ing power supplies, motor controls, inverters, choppers, audio amplifiers, high energy pulse circuits, and virtually any application where high reliability is required. The HEXFET transistor’s totally isolated package eliminates the need for additional isolating material between the device and the heatsink. This improves thermal efficiency and reduces drain capacitance. oC A POWER MOSFET THRU-HOLE (TO-254AA) 2/11/02 www.irf.com 1 1000V, N-CHANNEL HEXFET ® MOSFET TECHNOLOGY TO-254AA Product Summary Part Number RDS(on) ID IRFMG40 3.5 Ω 3.9A Features: n Simple Drive Requirements n Ease of Paralleling n Hermetically Sealed n Electrically Isolated n Dynamic dv/dt Rating n Light-weight For footnotes refer to the last page IRFMG40 |
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