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MSTM-S3-IT3 Datasheet(PDF) 15 Page - Connor-Winfield Corporation |
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MSTM-S3-IT3 Datasheet(HTML) 15 Page - Connor-Winfield Corporation |
15 / 16 page Data Sheet #: TM034 Page 15 of 16 Rev: P01 Date: 12 / 04 / 02 © Copyright 2002 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice Package Dimensions Figure 21 Recommended Footprint Dimensions Figure 22 Characteristic Measurements Table 6 Side Assembly View Figure 23 TOP SIDE SOLDER RESIST (OVER PAD) PCB SIDE VIEW BOTTOM SIDE SOLDER RESIST (UP TO PAD) Characteristic Item Measurement (inches) Pad to Pad Spacing 0.200 Solder pad top O.D. 0.150 Solder pad top I.D. 0.055 Solder pad bottom O.D. 0.150 Solder pad bottom I.D. 0.055 Solder mask top dia. 0.070 Solder mask bottom dia. 0.155 Pin row to row spacing 1.600 |
Similar Part No. - MSTM-S3-IT3 |
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Similar Description - MSTM-S3-IT3 |
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