Data Sheet #: TM034

Page 15 of 16

Rev: P01

Date: 12 / 04 / 02

© Copyright 2002 The Connor-Winfield Corp.

All Rights Reserved Specifications subject to change without notice

Package Dimensions

Figure 21

Recommended Footprint Dimensions

Figure 22

Characteristic Measurements

Table 6

Side Assembly View

Figure 23

TOP SIDE

SOLDER RESIST

(OVER PAD)

PCB

SIDE VIEW

BOTTOM SIDE

SOLDER RESIST

(UP TO PAD)

Characteristic Item

Measurement (inches)

Pad to Pad Spacing

0.200

Solder pad top O.D.

0.150

Solder pad top I.D.

0.055

Solder pad bottom O.D.

0.150

Solder pad bottom I.D.

0.055

Solder mask top dia.

0.070

Solder mask bottom dia.

0.155

Pin row to row spacing

1.600