IR2010(S)PBF

3

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© 2015 International Rectifier

April 14, 2015

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage

parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are

measured under board mounted and still air conditions.

Symbol

Definition

Min.

Max.

Units

High side floating supply voltage

-0.3

225

V

High side floating supply offset voltage

High side floating output voltage

Low side fixed supply voltage

-0.3

25

Low side output voltage

-0.3

Logic supply voltage

-0.3

Logic supply offset voltage

Logic input voltage (HIN, LIN & SD)

Allowable offset supply voltage transient (figure 2)

—

50

V/ns

Package power dissipation

14-Lead PDIP

—

1.6

W

16-Lead SOIC

—

1.25

Thermal resistance, junction to

ambient

14-Lead PDIP

—

75

°C/W

16-Lead SOIC

—

100

Junction temperature

—

150

°C

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

Recommended Operating Conditions

The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within

Typical ratings at other bias conditions are shown in figures 24 and 25.

Symbol

Definition

Min.

Max.

Units

High side floating supply absolute voltage

V

High side floating supply offset voltage

†

200

High side floating output voltage

Low side fixed supply voltage

10

20

Low side output voltage

0

Logic supply voltage

Logic supply offset voltage

-5

††

5

Logic input voltage (HIN, LIN, & SD)

Ambient temperature

-40

125

°C

†

(Please refer to the Design Tip DT97-3 for more details).