BAT74_3

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Product data sheet

Rev. 03 — 19 April 2010

6 of 10

NXP Semiconductors

BAT74

Schottky barrier double diode

11. Soldering

Fig 7.

Reflow soldering footprint BAT74 (SOT143B)

Fig 8.

Wave soldering footprint BAT74 (SOT143B)

solder lands

solder resist

occupied area

solder paste

sot143b_fr

0.9

0.6

0.7

3.25

3

0.6

(3

×)

0.6

(3

×)

0.5

(3

×)

0.7

(3

×)

1

1.9

2

0.75

0.95

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot143b_fw

4.6

4.45

1.2

(3

×)

1.425

(3

×)

1.425

1

1.2

2.2

2.575

Dimensions in mm