NCV8669

http://onsemi.com

3

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Min

Max

Unit

Input Voltage DC (Note 1)

DC

Transient, t < 100 ms

−0.3

−

40

45

V

Input Current

−5

−

mA

Output Voltage (Note 2)

−0.3

5.5

V

Output Current

−3

Current Limited

mA

Sense Input Voltage DC

DC

Transient, t < 100 ms

−0.3

−

40

45

V

Sense Input Current Range

−1

1

mA

DT (Reset Delay Time Select) Voltage

−0.3

5.5

V

DT (Reset Delay Time Select) Current

−1

1

mA

Reset Output Voltage

−0.3

5.5

V

Reset Output Current

−3

3

mA

Sense Output Voltage

−0.3

5.5

V

Sense Output Current

−3

3

mA

Junction Temperature

−40

150

°C

Storage Temperature

−55

150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

Rating

Symbol

Min

Max

Unit

ESD Capability, Human Body Model

−2

2

kV

ESD Capability, Machine Model

−200

200

V

ESD Capability, Charged Device Model

−1

1

kV

3. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

ESD Charged Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)

Rating

Symbol

Min

Max

Unit

Moisture Sensitivity Level

MSL

1

−

Lead Temperature Soldering

Reflow (SMD Styles Only), Pb−Free Versions

−

265 peak

°C

4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

Rating

Symbol

Value

Unit

Thermal Characteristics

Thermal Resistance, Junction−to−Air (Note 6)

Thermal Reference, Junction−to−Lead (Note 6)

94

18

°C/W

5. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.