NCP4688

http://onsemi.com

2

Figure 2. Simplified Schematic Block Diagram

Current Limit

Vin

GND

Vref

CE

Vout

Noise Reduction

NCP4688xxxx

Current Limit

Vin

GND

Vref

CE

Vout

Noise Reduction

NCP4688D

Table 1. PIN FUNCTION DESCRIPTION

Pin No.

SOT−23−5

Pin No.

DFN 1x1

Pin Name

Description

1

4

VIN

Input pin

2

2

GND

Ground pin

3

3

CE

Chip enable pin (“H” active)

4

NC

Non connected

5

1

VOUT

Output pin

*EP

EP

Exposed Pad (leave floating or connect to GND)

Table 2. ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage

0 − 6 V

V

Output Voltage

V

Chip Enable Input

0 − 6 V

V

Power Dissipation SOT−23−5

420

mW

Power Dissipation mDFN 1.0 x 1.0 mm

400

Junction Temperature

−40 to 150

°C

Storage Temperature

−55 to 125

°C

ESD Capability, Human Body Model (Note 1)

2000

V

ESD Capability, Machine Model (Note 1)

200

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

Latchup Current Maximum Rating tested per JEDEC standard: JESD78