NCP571, NCV571

http://onsemi.com

11

PACKAGE DIMENSIONS

DFN6, 2x2.2, 0.65P

CASE 506BA

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.20 mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

B

E

D

D2

E2

BOTTOM VIEW

b

e

6X

0.10

B

0.05

A

C

C

K

6X

NOTE 3

2X

0.10 C

PIN ONE

REFERENCE

TOP VIEW

2X

0.10 C

7X

A

A1

0.08 C

0.10 C

C

SEATING

PLANE

SIDE VIEW

L

6X

1

3

4

6

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

b

0.20

0.30

D

2.00 BSC

D2

1.10

1.30

E

2.20 BSC

E2

0.70

0.90

e

0.65 BSC

K

0.20

−−−

L

0.25

0.35

L1

0.00

0.10

L1

6X

0.58

1.36

0.96

1

0.35

0.65

PITCH

2.50

6X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

A1

A3

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL B

DETAIL A

PACKAGE

OUTLINE

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