NCV8716

www.onsemi.com

2

Figure 2. Simplified Block Diagram

IN

OUT

MOSFET

DRIVER WITH

CURRENT LIMIT

THERMAL

SHUTDOWN

EEPROM

UVLO

GND

BANDGAP

REFERENCE

Table 1. PIN FUNCTION DESCRIPTION

Pin No.

wDFN6, 2 x 2

Pin

Name

Description

6

OUT

Regulated output voltage pin. A small 0.47

mF ceramic capacitor is needed from this pin to ground to

assure stability.

2

N/C

No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.

3, EXP

GND

Power supply ground. Exposed pad EXP must be tied with GND pin 3.

4

N/C

No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.

5

N/C

No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.

1

IN

Input pin. A small capacitor is needed from this pin to ground to assure stability.

Table 2. ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

−0.3 to 24

V

Output Voltage

−0.3 to 5

V

Output Short Circuit Duration

Indefinite

s

Maximum Junction Temperature

125

°C

Storage Temperature

−55 to 150

°C

ESD Capability, Human Body Model (Note 2)

2000

V

ESD Capability, Machine Model (Note 2)

200

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

Latch up Current Maximum Rating tested per JEDEC standard: JESD78

Table 3. THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Thermal Characteristics, wDFN6, 2 mm x 2 mm

Thermal Resistance, Junction−to−Air

120

°C/W