MC33375, NCV33375 Series

http://onsemi.com

12

PACKAGE DIMENSIONS

SOT−223 (TO−261)

CASE 318E−04

ISSUE N

1.5

0.059

mm

inches

SCALE 6:1

3.8

0.15

2.0

0.079

6.3

0.248

2.3

0.091

2.3

0.091

2.0

0.079

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

A1

b1

D

E

b

e

e1

4

12

3

0.08 (0003)

A

L1

C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCH.

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

1.50

1.63

1.75

0.060

INCHES

A1

0.02

0.06

0.10

0.001

b

0.60

0.75

0.89

0.024

b1

2.90

3.06

3.20

0.115

c

0.24

0.29

0.35

0.009

D

6.30

6.50

6.70

0.249

E

3.30

3.50

3.70

0.130

e

2.20

2.30

2.40

0.087

0.85

0.94

1.05

0.033

0.064

0.068

0.002

0.004

0.030

0.035

0.121

0.126

0.012

0.014

0.256

0.263

0.138

0.145

0.091

0.094

0.037

0.041

NOM

MAX

L1

1.50

1.75

2.00

0.060

6.70

7.00

7.30

0.264

0.069

0.078

0.276

0.287

−

−

e1

0

°

10°

0

°

10°

q

q

L

L

0.20

−−−

−−−

0.008

−−−

−−−