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DS111011

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

SGA3263Z

Suggested Pad Layout

Package Drawing

Dimensions in inches (millimeters)

Refer to drawing posted at www.rfmd.com for tolerances.

Pin

Function

Description

3RF IN

RF input pin. This pin requires the use of an external DC-blocking capacitor chosen for the frequency of operation.

1, 2,

4, 5

GND

Connection to ground. For optimum RF performance, use via holes as close to ground leads as possible to reduce lead

inductance.

tion.

Preliminary

Dimensions in inches [millimeters]

RF

OUT

RF

I N

Notes:

1. Provide a large ground pad area under device

pins 1, 2, 4, & 5 with many plated via holes as

shown.

2. Dimensions given for 50 Ohm RF I/O lines are for

31 mil thick Getek. Scale accordingly for different

board thicknesses and dielectric contants.

3. We recommend 1 or 2 ounce copper. Measure-

ments for this data sheet were made on a 31 mil

thick Getek with 1 ounce copper on both sides.