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RFCM2680

DS120518

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.

Application Circuit

Evaluation Board Layout

Note:

The ground plane of the RFCM2680 module should be soldered onto a board equipped with as many thermal vias as possible.

Underneath this thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete

module DC power (up to 10.4W). In any case the module backside temperature should not exceed 100°C.

C8

4.7nF

C3

4.7nF

R5

470



R6

470



C6

4.7nF

C5

1.2pF

C4

1.2pF

R2

3.9k



R3

1.5k



R4

10



C2

4.7nF

C10

0.5pF

D2

MM3Z5V6T1

R1

10k



D1

TGL34-33A

C1

220pF

C7

4.7nF

U1

RFCM2680

1

2

3

4

9

8

7

6

5

FB1

Bead 60



T3

RFXF0009

T1

RFXF0006

T2

RFXF0008

V+

GND

RF IN

RF OUT

R7

DNI

R8

DNI

R9

DNI

C9

DNI

C12

DNI

R10

DNI

R11

DNI

R12

DNI

C11

0.5pF

C14

DNI

C13

DNI