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DMN2400UV-13 Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMN2400UV-13 Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 6 page DMN2400UV Document number: DS31852 Rev. 7 - 2 2 of 6 www.diodes.com January 2011 © Diodes Incorporated DMN2400UV Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Drain-Source Voltage VDSS 20 V Gate-Source Voltage VGSS ±12 V Continuous Drain Current (Note 4) Steady State TA = 25°C TA = 85°C ID 1.33 0.84 A Pulsed Drain Current IDM 3 A Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Total Power Dissipation (Note 4) PD 530 mW Thermal Resistance, Junction to Ambient RθJA 233.8 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 5) Drain-Source Breakdown Voltage BVDSS 20 - - V VGS = 0V, ID = 250μA Zero Gate Voltage Drain Current TJ = 25°C IDSS - - 100 nA VDS = 20V, VGS = 0V Gate-Source Leakage IGSS - - ±1.0 μA VGS = ±4.5V, VDS = 0V - - ±50 VGS = ±10V, VDS = 0V ON CHARACTERISTICS (Note 5) Gate Threshold Voltage VGS(th) 0.5 - 0.9 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS (ON) - 0.3 0.48 Ω VGS = 5.0V, ID = 200mA - 0.35 0.5 VGS = 4.5V, ID = 600mA - 0.45 0.7 VGS = 2.5V, ID = 500mA - 0.55 0.9 VGS = 1.8V, ID = 350mA - 0.65 1.5 VGS = 1.5V, ID = 50mA Forward Transfer Admittance |Yfs| - 1.4 - S VDS = 10V, ID = 400mA Diode Forward Voltage (Note 5) VSD 0.7 1.2 V VGS = 0V, IS = 150mA, f = 1.0MHz DYNAMIC CHARACTERISTICS (Note 6) Input Capacitance Ciss - 36.0 - pF VDS =16V, VGS = 0V, f = 1.0MHz Output Capacitance Coss - 5.7 - pF Reverse Transfer Capacitance Crss - 4.2 - pF Gate Resistance Rg - 68 - Ω VDS = 0V, VGS = 0V, Total Gate Charge Qg - 0.5 - nC VGS =4.5V, VDS = 10V, ID =250mA Gate-Source Charge Qgs - 0.07 - nC Gate-Drain Charge Qgd - 0.1 - nC Turn-On Delay Time tD(on) - 4.06 - ns VDD = 10V, VGS = 4.5V, RL = 47Ω, RG = 10Ω, ID = 200mA Turn-On Rise Time tr - 7.28 - ns Turn-Off Delay Time tD(off) - 13.74 - ns Turn-Off Fall Time tf - 10.54 - ns Notes: 4. Device soldered onto FR-4 PCB, minimum recommended soldering pad dimensions (25.4mm x 25.4mm x1.6mm, 2oz Cu pad: 0.18mm 2 x 6). 5. Short duration pulse test used to minimize self-heating effect. 6. Guaranteed by design. Not subject to product testing. |
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