Electronic Components Datasheet Search |
|
DMN33D8LT-13 Datasheet(PDF) 2 Page - Diodes Incorporated |
|
DMN33D8LT-13 Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 5 page DMN33D8LT Document number: DS37091 Rev. 2 - 2 2 of 5 www.diodes.com July 2014 © Diodes Incorporated DMN33D8LT Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS 30 V Gain-Source Voltage VGSS ±20 V Drain Current (Note 5) Continuous ID 115 mA Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Total Power Dissipation (Note 5) PD 240 mW Thermal Resistance, Junction to Ambient(Note 5) RθJA 521 °C /W Total Power Dissipation (Note 6) PD 300 mW Thermal Resistance, Junction to Ambient(Note 6) RθJA 420 °C /W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@T A = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 30 ⎯ ⎯ V VGS = 0V, ID = 250µA Zero Gate Voltage Drain Current IDSS ⎯ ⎯ 1.0 µA VDS = 30V, VGS = 0V Gate-Body Leakage IGSS ⎯ ⎯ ±10 µA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) 0.8 ⎯ 1.5 V VDS = 3V, ID = 100µA Static Drain-Source On-Resistance RDS (ON) ⎯ ⎯ 5 Ω VGS = 4V, ID = 10mA ⎯ ⎯ 7 Ω VGS = 2.5V, ID = 5mA Diode Forward Voltage VSD ⎯ ⎯ 1.2 V VGS = 0V, IS = 115mA DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss ⎯ 48 ⎯ pF VDS = 5V, VGS = 0V, f = 1.0MHz Output Capacitance Coss ⎯ 11 ⎯ Reverse Transfer Capacitance Crss ⎯ 8 ⎯ Total Gate Charge VGS = 10V Qg ⎯ 0.55 ⎯ nC VGS = 10V, VDS = 10V, ID = 250mA Total Gate Charge VGS = 4.5V Qg ⎯ 1.23 ⎯ Gate-Source Charge Qgs ⎯ 0.14 ⎯ Gate-Drain Charge Qgd ⎯ 0.14 ⎯ Turn-On Delay Time tD(on) ⎯ 2.9 ⎯ nS VDD = 30V, ID = 0.2A, VGEN = 10V, RGEN = 25Ω Turn-On Rise Time tr ⎯ 2.6 ⎯ Turn-Off Delay Time tD(off) ⎯ 18.2 ⎯ Turn-Off Fall Time tf ⎯ 13.6 ⎯ Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. |
Similar Part No. - DMN33D8LT-13 |
|
Similar Description - DMN33D8LT-13 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |