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DMG6301UDW-7 Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMG6301UDW-7 Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 6 page DMG6301UDW Document number: DS36288 Rev. 1 - 2 2 of 6 www.diodes.com February 2014 © Diodes Incorporated DMG6301UDW Maximum Ratings (@T A = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS 25 V Gate-Source Voltage VGSS 8 V Continuous Drain Current, VGS = 4.5V (Note 6) TA = +25°C TA = +70°C ID 0.24 0.19 A Continuous Drain Current, VGS = 2.7V (Note 6) TA = +25°C TA = +70°C ID 0.22 0.17 A Pulsed Drain Current (10µs pulse, duty cycle = 1%) IDM 1.5 A Thermal Characteristics Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 0.3 W (Note 6) 0.37 Thermal Resistance, Junction to Ambient (Note 5) RΘJA 409 °C/W (Note 6) 334 Thermal Resistance, Junction to Case (Note 6) RΘJC 137 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@T A = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 25 — — V VGS = 0V, ID = 250µA Zero Gate Voltage Drain Current IDSS — — 1 µA VDS = 20V, VGS = 0V Gate-Body Leakage IGSS — — 100 nA VGS = 8V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) 0.65 0.85 1.5 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS(ON) — 3.8 4 Ω VGS = 4.5V, ID = 0.4A — 3.1 5 Ω VGS = 2.7V, ID = 0.2A Forward Transconductance |Yfs| ⎯ 1 ⎯ S VDS = 5V, ID =0.4A Diode Forward Voltage VSD — 0.76 1.2 V VDS = VGS, ID = 0.25A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss — 27.9 — pF VDS = 10V, VGS = 0V, f = 1MHz Output Capacitance Coss — 6.1 — Reverse Transfer Capacitance Crss — 2 — Total Gate Charge Qg — 0.36 — nC VGS = 4.5V, VDS = 5V, ID = 0.2A Gate-Source Charge Qgs — 0.06 — Gate-Drain Charge Qgd — 0.04 — Turn-On Delay Time tD(on) — 2.9 — nS VGS = 4.5V, VDS = 6V ID = 0.5A, RG = 50Ω Turn-On Rise Time tr — 1.8 — Turn-Off Delay Time tD(off) — 6.6 — Turn-Off Fall Time tf — 2.3 — Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to production testing. |
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