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LTM8033 Datasheet(PDF) 16 Page - Linear Technology |
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LTM8033 Datasheet(HTML) 16 Page - Linear Technology |
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16 / 26 page  LTM8033 16 8033fb For more information www.linear.com/LTM8033 APPLICATIONS INFORMATION PCB Layout Most of the headaches associated with PCB layout have been alleviated or even eliminated by the high level of integration of the LTM8033. The LTM8033 is neverthe- less a switching power supply, and care must be taken to minimize EMI and ensure proper operation. Even with the high level of integration, you may fail to achieve specified operation with a haphazard or poor layout. See Figure 4 for a suggested layout. Ensure that the grounding and heat sinking are acceptable. A few rules to keep in mind are: 1. Place the RADJ and RT resistors as close as possible to their respective pins. 2. Place the CIN and CFIN capacitors as close as possible to the VIN, FIN and GND connections of the LTM8033. A haphazardly placed CFIN capacitor may impair EMI performance. 3. Place the COUT capacitors as close as possible to the VOUT and GND connection of the LTM8033. Figure 4. Layout Showing Suggested External Components, GND Plane and Thermal Vias 4. Place the CIN, CFIN and COUT capacitors such that their ground currents flow directly adjacent or underneath the LTM8033. 5. Connect all of the GND connections to as large a copper pour or plane area as possible on the top layer. Avoid breaking the ground connection between the external components and the LTM8033. 6. Use vias to connect the GND copper area to the board’s internal ground planes. Liberally distribute these GND vias to provide both a good ground connection and thermal path to the internal planes of the printed circuit board. Pay attention to the location and density of the thermal vias in Figure 4. The LTM8033 can benefit from the heat sinking afforded by vias that connect to internal GND planes at these locations, due to their proximity to internal power handling components. The optimum number of thermal vias depends upon the printed circuit board design. For example, a board might use very small via holes. It should employ more thermal vias than a board that uses larger holes. PG RADJ RT SYNC GND SHARE FIN RUN/SS GND VOUT GND VIN COUT CIN THERMAL VIAS TO GND LTM8033 BIAS AUX CFIN |
Similar Part No. - LTM8033_15 |
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Similar Description - LTM8033_15 |
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