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H2A1-H760 Datasheet(PDF) 4 Page - Roithner LaserTechnik GmbH

Part No. H2A1-H760
Description  IR High Power single chip LED
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Maker  ROITHNER [Roithner LaserTechnik GmbH]
Homepage  http://www.roithner-laser.com
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H2A1-H760 Datasheet(HTML) 4 Page - Roithner LaserTechnik GmbH

   
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13.08.2012
H2A1-H760
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Soldering Conditions
Reflow Soldering:
APG2C1 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use
a reflow soldering process for array assembly!
Hot Bar Soldering:
A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process
will only transfer heat to the leads and avoids overheating the emitter which will damage the
device. In order to transfer sufficient heat from the hot bar to the device, following parameters
must be carefully considered:
Amount of flux
Pressing force of solder tip
Hot bar temperature
For the standard assembly process, following parameters should be maintained:
Hot Bar temperature: 330 °C
Force of Hot Bar. 40 N
Soldering time: 1.5 s
It is recommended to use a copper nickel-plated hot bar mounted to standard temperature
controlled soldering equipment.
Manual Hand Soldering:
For prototype build or small series production runs, it is possible to place and solder the
emitters by hand. It is therefore recommended to maintain the following parameters:
Solder Tip Temperature 330 °C
Soldering time. < 1.5 s
Junction temperature must be kept below 70 °C
A visual inspection may be used to check the quality of the solder joint
General Soldering Precautions:
Mechanical stress, shock and vibration must be avoided during soldering
Only use non corrosive flux.
Do not apply current to the device until it has cooled down to room temperature after
soldering.


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