10

LTC485

TYPICAL APPLICATIO S

Typical RS485 Network

LTC485 • TA03

PACKAGE DESCRIPTIO

Dimensions in inches (millimeters) unless otherwise noted.

J8 Package

8-Lead Ceramic DIP

J8 0293

0.014 – 0.026

(0.360 – 0.660)

0.200

(5.080)

MAX

0.015 – 0.060

(0.381 – 1.524)

0.125

3.175

MIN

0.100 ± 0.010

(2.540 ± 0.254)

0.290 – 0.320

(7.366 – 8.128)

0.008 – 0.018

(0.203 – 0.457)

0° – 15°

0.385 ± 0.025

(9.779 ± 0.635)

0.005

(0.127)

MIN

0.405

(10.287)

MAX

0.220 – 0.310

(5.588 – 7.874)

12

3

4

87

65

0.025

(0.635)

RAD TYP

0.045 – 0.068

(1.143 – 1.727)

FULL LEAD

OPTION

0.023 – 0.045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

0.045 – 0.068

(1.143 – 1.727)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.