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LTC2408I Datasheet(PDF) 22 Page - Linear Technology |
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LTC2408I Datasheet(HTML) 22 Page - Linear Technology |
22 / 36 page 22 LTC2404/LTC2408 APPLICATIONS INFORMATION mode. However, certain applications may require an exter- nal driver on SCK. If this driver goes HI-Z after outputting a LOW signal, the LTC2404/LTC2408’s internal pull-up remains disabled. Hence, SCK remains LOW. On the next falling edge of CSADC, the device is switched to the external SCK timing mode. By adding an external 10k pull- up resistor to SCK, this pin goes HIGH once the external driver goes HI-Z. On the next CSADC falling edge, the device will remain in the internal SCK timing mode. A similar situation may occur during the sleep state when CSADC is pulsed HIGH-LOW-HIGH in order to test the conversion status. If the device is in the sleep state (EOC = 0), SCK will go LOW. Once CSADC goes HIGH (within the time period defined above as tEOCtest), the internal pull-up is activated. For a heavy capacitive load on the SCK pin, the internal pull-up may not be adequate to return SCK to a HIGH level before CSADC goes LOW again. This is not a concern under normal conditions where CSADC remains LOW after detecting EOC = 0. This situation is easily avoided by adding an external 10k pull- up resistor to the SCK pin. DIGITAL SIGNAL LEVELS The LTC2404/LTC2408’s digital interface is easy to use. Its digital inputs (FO, CSADC, CSMUX, CLK, DIN and SCK in External SCK mode of operation) accept standard TTL/ CMOS logic levels and can tolerate edge rates as slow as 100 µs.However,someconsiderationsarerequiredtotake advantage of exceptional accuracy and low supply current. The digital output signals (SDO and SCK in Internal SCK mode of operation) are less of a concern because they are not generally active during the conversion state. In order to preserve the accuracy of the LTC2404/LTC2408, it is very important to minimize the ground path imped- ance which may appear in series with the input and/or reference signal and to reduce the current which may flow through this path. The COM pin (Pin 6) should be con- nected to a low resistance ground plane through a mini- mum length trace. The use of multiple via holes is recom- mended to further reduce the connection resistance. The LTC2404/LTC2408’s power supply current flowing through the 0.01 Ω resistance of the common ground pin will develop a 2.5 µV offset signal. For a reference voltage VREF = 2.5V, this represents a 1ppm offset error. In an alternative configuration, the COM pin of the converter can be the single-point-ground in a single point grounding system. The input signal ground, the reference signal ground, the digital drivers ground (usually the digital ground) and the power supply ground (the analog ground) should be connected in a star configuration with the com- mon point located as close to the COM pin as possible. The power supply current during the conversion state should be kept to a minimum. This is achieved by restrict- ing the number of digital signal transitions occurring during this period. While a digital input signal is in the 0.5V to (VCC – 0.5V) range, the CMOS input receiver draws additional current from the power supply. It should be noted that, when any one of the digital input signals (FO, CSADC, CSMUX, DIN, CLK and SCK in External SCK mode of operation) is within this range, the LTC2404/LTC2408 power supply current may increase even if the signal in question is at a valid logic level. For micropower operation and in order to minimize the potential errors due to additional ground pin current, it is recommended to drive all digital input signals to full CMOS levels [VIL < 0.4V and VOH > (VCC – 0.4V)]. Severe ground pin current disturbances can also occur due to the undershoot of fast digital input signals. Under- shoot and overshoot can occur because of the imped- ance mismatch at the converter pin when the transition time of an external control signal is less than twice the propagation delay from the driver to LTC2404/LTC2408. For reference, on a regular FR-4 board, signal propaga- tion velocity is approximately 183ps/inch for internal traces and 170ps/inch for surface traces. Thus, a driver generating a control signal with a minimum transition time of 1ns must be connected to the converter pin through a trace shorter than 2.5 inches. This problem becomes particularly difficult when shared control lines are used and multiple reflections may occur. The solution is to carefully terminate all transmission lines close to their characteristic impedance. Parallel termination near the LTC2404/LTC2408 input pins will eliminate this problem but will increase the driver |
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