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LT3570 Datasheet(PDF) 19 Page - Linear Technology

Part No. LT3570
Description  1.5A Buck Converter, 1.5A Boost Converter and LDO Controller
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Maker  LINER [Linear Technology]
Homepage  http://www.linear.com
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LT3570 Datasheet(HTML) 19 Page - Linear Technology

 
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LT3570
19
3570fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UF Package
24-Lead Plastic QFN (4mm
× 4mm)
(Reference LTC DWG # 05-08-1697)
PACKAGE DESCRIPTION
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CB
4.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
24
23
1
2
BOTTOM VIEW—EXPOSED PAD
2.45 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF24) QFN 0105
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.45 ± 0.05
(4 SIDES)
3.10 ± 0.05
4.50 ± 0.05
PACKAGE
OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
FE20 (CB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0
° – 8°
0.25
REF
RECOMMENDED SOLDER PAD LAYOUT
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
13 4 5 6 7 89 10
11
12
14 13
6.40 – 6.60*
(.252 – .260)
3.86
(.152)
2.74
(.108)
20 1918 17 16 15
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
2.74
(.108)
0.45
±0.05
0.65 BSC
4.50
±0.10
6.60
±0.10
1.05
±0.10
3.86
(.152)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC


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