TAI-SAW TECHNOLOGY CO., LTD.

8

TST DCC

Release document

H. RECOMMENDED REFLOW PROFILE :

1. Preheating shall be fixed at 150~180℃ for 60~90 seconds.

2. Ascending time to preheating temperature 150℃ shall be 30 seconds min.

3. Heating shall be fixed at 220℃ for 50~80 seconds and at 245~260℃ peak (min. 10sec).

4. Time : 2 times.

I. STORAGE CONDITIONS :

1) Store in manufacturer’s package or tightly reclosed box with the following conditions.

[Temperature: -10...+40°C, Humidity: 30...85%RH] Examine solderability before using this

component, since more than 6 months storage might be a cause of degradation of

solderability. Notice that long-term storage might be a cause of the discoloration.

2) To keep solderability of outer-electrode, do not store in the following environments.

• Ambient air containing corrosive gas (C12, H2S, NH3, SOX, NOX, etc.)

• Ambient air containing volatile or combustible gas

• In dusty place

• In the places where the water splashes and it tends to condense for high humid

• In direct sunlight

• In the places under the strong influence of static electricity or electric field strength

Contact the manufacturer before using the component in any of the above environments.

3) Do not open minimum packing unit until usage.