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LT1571-5 Datasheet(PDF) 2 Page - Linear Technology |
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LT1571-5 Datasheet(HTML) 2 Page - Linear Technology |
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2 / 16 page  2 LT1571 Series Supply Voltage (VCC) .............................................. 28V BOOST Pin Voltage with Respect to VCC ................. 20V FLAG Pin Voltage ..................................................... VCC IBAT (Average)........................................................ 1.5A Switch Current (Peak) .............................................. 2A Storage Temperature Range ................. – 65 °C to 150°C Operating Ambient Temperature Range (Note 2) .................. – 40 °C to 85°C Operating Junction Temperature Range .............................. – 40 °C to 125°C Lead Temperature (Soldering, 10 sec).................. 300 °C Consult factory for Industrial and Military grade parts. * VCC1 AND VCC2 SHOULD BE CONNECTED TOGETHER CLOSE TO THE PINS ** FOUR CORNER PINS ARE FUSED TO INTERNAL DIE ATTACH PADDLE FOR HEAT SINKING. CONNECT THESE FOUR PINS TO EXPANDED PC LANDS FOR PROPER HEAT SINKING LT1571EGN-1 ORDER PART NUMBER TJMAX = 125°C, θJA = 40°C/ W TOP VIEW GN PACKAGE 16-LEAD NARROW PLASTIC SSOP 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 **GND SW BOOST BAT2 FLAG SELECT SENSE **GND GND** VCC1* VCC2* CAP PROG VC BAT GND** 1 2 3 4 5 6 7 8 9 10 11 12 13 14 TOP VIEW GN PACKAGE 28-LEAD NARROW PLASTIC SSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 **GND **GND **GND SW BOOST BAT2 FLAG NC SELECT SENSE **GND **GND **GND **GND GND** GND** GND** GND** VCC1* VCC2* CAP PROG VC BAT GND** GND** GND** GND** 1 2 3 4 5 6 7 8 9 10 11 12 13 14 TOP VIEW GN PACKAGE 28-LEAD NARROW PLASTIC SSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 **GND **GND **GND SW BOOST NC FLAG NC VFB SENSE **GND **GND **GND **GND GND** GND** GND** GND** VCC1* VCC2* CAP PROG VC BAT GND** GND** GND** GND** * VCC1 AND VCC2 SHOULD BE CONNECTED TOGETHER CLOSE TO THE PINS ** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO EXPANDED PC LANDS FOR PROPER HEAT SINKING 40 °C/W THERMAL RESISTANCE ASSUMES AN INTERNAL GROUND PLANE DOUBLING AS A HEAT SPREADER TJMAX = 125°C, θJA = 40°C/ W * VCC1 AND VCC2 SHOULD BE CONNECTED TOGETHER CLOSE TO THE PINS ** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO EXPANDED PC LANDS FOR PROPER HEAT SINKING 40 °C/W THERMAL RESISTANCE ASSUMES AN INTERNAL GROUND PLANE DOUBLING AS A HEAT SPREADER ORDER PART NUMBER ORDER PART NUMBER TJMAX = 125°C, θJA = 75°C/ W LT1571EGN-2 LT1571EGN-5 (Note 1) ABSOLUTE AXI U RATI GS PACKAGE/ORDER I FOR ATIO |
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